SMT BGA Flux Syringe – Lead-Free Soldering Paste for RC Model Electronics Repair

Description

Specification: Viscosity: 100 (Pa·S) Particle size: 20-38 (um) Alloy composition: lead tin paste Weight: 35g  The product has good wettability, good dry resistance, and long shelf life at room temperature.
It is suitable for mobile phone repair industry, computer digital repair industry,
precision circuit board SMT soldering, BGA process soldering, etc.
Package included: 1 x SMT BGA Syringe Flux Tin Soldering Paste Syringe Solder Paste RC Model Spare Part

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